Application
This product is used for semiconductor wafer cleaning pumps.
This device is suitable for SW300 and SP300-G2 series high-pressure pump systems, featuring intelligent monitoring and automatic protection functions. When the system detects abnormal water intake causing pump dry running, the anti-dry-run protection mechanism will automatically cut off the pneumatic control circuit and force the pump to stop operation, effectively preventing damage to critical components due to overheating. This design not only ensures equipment safety but also significantly extends pump service life and enhances overall system reliability.
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Specification | |
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Activation pressure |
40 bar |
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Closing time |
<3 sec |
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Control pressure |
4 bar |
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Maximum driving air pressure |
6 bar |
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Suggested output pressure |
25~110 bar |
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Output media |
DI water, IPA |
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Main material |
6061-T6 |
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Features |
1. Pure mechanical assembly design with convenient consumable and component replacement. |
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Note |
Installation of the anti-air burning mechanism group - Pre-check items:
1. Check whether there are threaded holes for installation near the control air pressure input hole on the pump air valve block:
-Specification: M4×0.7P
-Quantity: 2 threaded holes
2. If the required threaded holes are not available, please contact the equipment supplier to arrange for the processing of the required threaded holes
✓ After completing the above inspections, the installation of the anti-air burning mechanism group can be carried out.
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